iot

Semiconductor growth has accelerated to higher levels that may represent a new normal as suggested by our “battle of exponentials” framework.

At the Applied Materials Master Class today, we highlight two fast-growing and highly enabling areas of the semiconductor industry. “ICAPS” silicon powers billions of new devices on the edge—including electric vehicles. No longer an afterthought, packaging now enables the benefits associated with Moore’s Law to continue even as 2D scaling slows. Today’s class demonstrates that the AI Era requires innovation across a wide range of technologies, from the edge to the cloud.

As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.

2020 will be remembered most for the challenges of COVID-19. In the world of technology, it will be remembered for accelerating digital transformations that would have taken many more years to play out. Entering 2021, the dependency between the global economy and semiconductors is greater than it’s ever been. At the same time, the way chips are being made is changing as traditional Moore’s Law scaling slows. Applied Materials is dedicated to driving new ways to help our customers continue to deliver improvements in chip power, performance and cost, in record time.

Amid a slowdown in classic Moore’s Law scaling, heterogeneous design and advanced packaging play a growing role in the logic roadmap.

Our latest in a series of blogs inspired by Applied Materials’ panel discussion at IEDM explores where and how data should be processed and stored to drive computing efficiency while curbing energy consumption.

Applied Materials moderated a thought-provoking panel discussion during IEDM which showed that while there is no single path to achieving continued improvements in chip performance, power and area-cost, the industry will be well-served to search for solutions together.

The AI Era is fueling an explosion of data, while Moore’s Law is no longer the predictable engine of progress that it once was. With opportunities and challenges of this magnitude, we need to open the strategic planning lens and decide where we want to be in 2029.

Applied Materials experts will deliver two presentations focused on emerging memories: MRAM, PCRAM and ReRAM.